· As a component in calibration gas . · In first-aid treatment of emergencies such as suffocation and heart attack . · In the treatment of patients with respiratory disorders . · In anaesthesia . · In chemical oxidation reaction studies . · In semiconductor fabrication, chemical vapour deposition of silicon dioxide . · In semiconductor fabrication, thermal oxide growth . · In semiconductor fabrication, plasma etching . · In semiconductor fabrication, plasma stripping of photoresist . · In semiconductor fabrication, carrier gas in certain deposition/diffusion operations.
Product Name:Oxygen O2
Packing: 40L, 47L, 50L cylinder(GB, ISO, DOT)
Filling Content: 5-6m3/cyl
Items
Specifications
O2
100.00%
100.00%
100.00%
Ar
≤3.0 ppmv
≤3.0 ppmv
≤1.0 ppmv
N2
≤25.0ppmv
≤5.0 ppmv
≤1.0 ppmv
CO2
≤0.5 ppmv
≤0.1 ppmv
≤0.1 ppmv
CO
≤0.5 ppmv
≤0.1 ppmv
≤0.1 ppmv
THC（CH4 )
≤0.5 ppmv
≤0.1 ppmv
≤0.1 ppmv
H2O
≤2.0 ppmv
≤0.5 ppmv
≤0.1 ppmv
H2
≤1.0 ppmv
≤0.1 ppmv
≤0.1 ppmv
Transportation
DOT Shipping Name
Oxygen Compressed
DOT Classification
2.2
DOT Label
Non-flammable Gas
UN Number
UN 1072
CAS No.
7782-44-7
CGA/DISS/JIS/BS341/DIN477
540/714/W22-14R/NO.3/NO.9
Shipped as
Compressed Gas
Technical Information
Cylinder State @ 21.1°C
Gas
Flammable Limits In Air
Non-flammable
Auto Ignition Temperature (°C )
-
Molecular Weight (g/mol)
31.999
Specific gravity (air =1)
1.105
Critical Temperature ( °C )
-118.57
Critical Pressure ( psig )
714.4
Applications
· As a component in calibration gas . · In first-aid treatment of emergencies such as suffocation and heart attack . · In the treatment of patients with respiratory disorders . · In anaesthesia . · In chemical oxidation reaction studies . · In semiconductor fabrication, chemical vapour deposition of silicon dioxide . · In semiconductor fabrication, thermal oxide growth . · In semiconductor fabrication, plasma etching . · In semiconductor fabrication, plasma stripping of photoresist . · In semiconductor fabrication, carrier gas in certain deposition/diffusion operations.
